Venue: Chicago, Illinois

Pack Expo International 2008, the largest packaging exhibition held in the United States, will again be co-located with the Process Expo 2008 and the Converting & Package Printing Expo (CPP).  Pack Expo International 2008/Process Expo/CPP Expo will feature 2000+ companies displaying in over 1.2 million net square feet of exhibit space.  The Process Expo will feature over 550 companies in over 200,000 net square feet of exhibit space.  

Pack Expo International 2008 will also be co-located with the Converting & Package Printing Expo (CPP).  This co-location reflects the new market synergies of the package printing, converting, finishing machinery & supplies industries. CPP Expo showcases the latest in printing, coating, slitting and other state-of-the-art finishing processes.  

Pack Expo International 2008/Process Expo/CPP Expo will be the premier showcase for packaging, attracting companies which represent every sector of the industry to exhibit the latest innovations in their specialized products, including state-of-the-art advances in packaging and related converting machinery, materials, packages, containers, controls, software, components, sensing and inspection systems, robotics and design systems.  Pack Expo International is scoped to accommodate all size exhibits and product introductions by the most prominent companies in the industry.  Pack Expo International is a bienneal event – ideally timed for important industry updates and new product technology.  

Pack Expo International 2008/Process Expo/CPP Expo will also feature several pavilions.  They are the brand protection Center, containers & materials, contract packaging, RFID, and the showcase of packaging innovations.  The brand protection center will focus on packaging initiatives and technologies to protect against bio-terrorism, package tampering counterfeiting and product adulteration.  The containers and materials pavilion will focus on the latest innovations in materials, containers, and converting machinery.  The prominence of contract packaging services in today’s vibrant marketplace will be highlighted in the contract packaging pavilion.  Pack Expo will feature a RFID pavilion again this year, included in the exhibits will be technologies to upgrade conventional lines into RFID-enabled packaging lines.  The showcase of packaging innovations will once again showcase award winning packaging designs from all over the world.

Process Expo 2008 exhibitors will focus on the newest developments in processing technology to meet the challenges faced by the industry’s food, beverage, and pharmaceutical manufacturers.  Every aspect of the supply chain will be represented, from ingredients and flavors to shipping.  The Process Expo 2008 is sponsored and produced by the Food Processing Suppliers Association (FPSA).  

Visit www.packexpo.com or www.fpsa.org for more information on the upcoming show.

If you are interested in attending these events and availing of the free registration offer, please complete the attached reply form. Complete information on the shows (including show guide and exhibitor information) is available on the official websites.

Contact: Nicola Hale, nicola.hale@N0SPAM.mail.doc.gov