November 9-13, 2008
McCormick Place, West Building
Chicago, Illinois
PACK EXPO 2008, to be held at McCormick Place, will focus on the latest developments in packaging technology and will showcase exhibitors' state-of-the-art advancements in:
- Packaging and processing machinery
- Converting machinery
- Materials
- Containers
- Components
- Services
- And more
You will discover ways to cut costs and increase productivity while exploring the newest technologies and networking with other packaging professionals. For further information, please visit http://www.fpsa.org/processExpo/.
PACK EXPO is held biennially – ideal timing for new product technology introductions. Exhibitors will bring their top technicians and engineers to provide onsite packaging solutions to even the toughest packaging challenges. Co-located with PROCESS EXPO 2008 and Converting & Package Printing (CCP) EXPO, PACK EXPO is one of the world’s leading and most comprehensive packaging events created to meet the needs of everyone in the industry. Over 2,000 exhibiting companies will be utilizing more than 1.2 million net square feet of space.
Finnish companies interested in receiving more information on PACK EXPO 2008 and the services U.S. Commercial Service provides are welcome to contact our office at helsinki.office.box@mail.doc.gov