The U.S. Department of Commerce invites you to join the Green Builiding Products Trade Mission to Hong Kong, the Philippines, and Singapore, June 4-12, 2007. This mission offers timely opportunities to tap into some of the fastest growing markets for U.S. green building products and services.
Best prospects for U.S. companies include:
- Products/systems for water conservation
- Products/systems that can harness renewable energy such as Building Integrated Photovoltaic (BIPV), wind and biomass
- Products/systems that can improve the energy and water efficiency of a building
- Products/systems that improve the indoor environment quality
- Construction systems that reduce noise and air pollution
- Recyclable materials
In each country, you will receive:
- Individual Business Meetings with pre-screened prospective agents, distributors, partners, and end-users
- Participation in Country Briefings by U.S. Embassy and Consulate officials
- Networking Receptions with local government officials and private companies (e.g. property developers, architects, engineers and building materials companies)
- Full Logistical Support
Timetable:
Hong Kong - June 3-5, 2007
Philippines - June 6-8, 2007
Singapore - June 10-12, 2007
Participation Fee: $3,600 per company, $300 for each additional company representative (lodging and airfare not included)
For more information on the Greenbuilding sector in Hong Kong, Singapore, and the Philippines, please visit the following links for the latest market briefs:
Hong Kong
Philippines
Singapore
The deadline to submit applications is April 30, 2007. Register online at: http://www.buyusa.gov/downtownlosangeles/greenbuild_registration.html
For more information on the Green Building Products Trade Mission to Asia, please contact:
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Commercial Service U.S.A. |
Commercial Service Hong Kong |
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Commercial Service Philippines |
Commercial Service Singapore Hawcheng Ng Commercial Specialist American Embassy - Singapore 27 Napier Road Singapore 258508 Tel: (65) 6476-9037 Fax: (65) 6476-9080 Email: hawcheng.ng@mail.doc.gov |